datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

ML12002CP View Datasheet(PDF) - LANSDALE Semiconductor Inc.

Part Name
Description
View to exact match
ML12002CP
LANSDALE
LANSDALE Semiconductor Inc. LANSDALE
ML12002CP Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
ML12002
LANSDALE Semiconductor, Inc.
14
1
A
F
N
–T–
SEATING
PLANE
H
G
OUTLINE DIMENSIONS
P DIP 14 = CP
PLASTIC PACKAGE
(ML12002CP)
CASE 646–06
ISSUE M
8
B
7
L
C
K
J
D 14 PL
M
0.13 (0.005) M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
DIM MIN MAX
A 0.715 0.770
B 0.240 0.260
C 0.145 0.185
D 0.015 0.021
F 0.040 0.070
G 0.100 BSC
H 0.052 0.095
J 0.008 0.015
K 0.115 0.135
L 0.290 0.310
M ––– 10
N 0.015 0.039
MILLIMETERS
MIN MAX
18.16 18.80
6.10 6.60
3.69 4.69
0.38 0.53
1.02 1.78
2.54 BSC
1.32 2.41
0.20 0.38
2.92 3.43
7.37 7.87
––– 10
0.38 1.01
Page 8 of 9
www.lansdale.com
Issue A
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]