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LM1086CS-ADJ View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
LM1086CS-ADJ 1.5-A Low Dropout Positive Regulators Texas-Instruments
Texas Instruments Texas-Instruments
LM1086CS-ADJ Datasheet PDF : 30 Pages
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LM1086
SNVS039J – JUNE 2000 – REVISED APRIL 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)(2)
Maximum Input to Output Voltage Differential
Power Dissipation(3)
Junction Temperature (TJ)(4)
Lead Temperature
Storage temperature, Tstg
LM1086-ADJ
LM1086-1.8
LM1086-2.5
LM1086-3.3
LM1086-5.0
MIN
MAX
29
27
27
27
25
Internally Limited
150
260, to 10 sec
–65
150
UNIT
V
V
V
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application and Implementation. The
value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For
improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number
SNOA401).
(4) The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations
6.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
VALUE
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
JUNCTION TEMPERATURE RANGE (TJ)(1)
Control Section
"C" Grade
Output Section
Control Section
"I" Grade
Output Section
MIN
MAX
UNIT
0
125
°C
0
150
°C
40
125
°C
40
150
°C
(1) The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations.
4
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