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LM1084IS-12 View Datasheet(PDF) - National ->Texas Instruments

Part NameDescriptionManufacturer
LM1084IS-12 5A Low Dropout Positive Regulators National-Semiconductor
National ->Texas Instruments National-Semiconductor
LM1084IS-12 Datasheet PDF : 13 Pages
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Electrical Characteristics (Continued)
Typicals and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in Boldface type apply over the entire junc-
tion temperature range for operation.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
(Note 6) (Note 5) (Note 6)
ILIMIT
Current Limit
Minimum Load
Current (Note 10)
Quiescent Current
Thermal Regulation
Ripple Rejection
Adjust Pin Current
LM1084-ADJ
VIN−VOUT = 5V
VIN−VOUT = 25V
LM1084-3.3
VIN = 8V
LM1084-5.0
VIN = 10V
LM1084-12
VIN = 17V
LM1084-ADJ
VIN −VOUT = 25V
LM1084-3.3
VIN = 18V
LM1084-5.0
VIN 20V
LM1084-12
VIN 25V
TA = 25˚C, 30ms Pulse
fRIPPLE = 120Hz, = COUT = 25µF Tantalum,
IOUT = 5A
LM1084-ADJ, CADJ, = 25µF, (VIN−VO) = 3V
LM1084-3.3, VIN = 6.3V
LM1084-5.0, VIN = 8V
LM1084-12 VIN = 15V
LM1084
5.5
8.0
A
0.3
0.6
A
5.5
8.0
A
5.5
8.0
A
5.5
8.0
A
5
10.0
mA
5.0
10.0
mA
5.0
10.0
mA
5.0
0.003
10.0
0.015
mA
%/W
60
75
dB
60
72
dB
60
68
dB
54
60
dB
55
120
µA
Adjust Pin Current
Change
Temperature
Stability
10mA IOUT IFULL LOAD,
1.5V VIN−VOUT 25V
0.2
5
µA
0.5
%
Long Term Stability
RMS Output Noise
(% of VOUT)
Thermal Resistance
Junction-to-Case
TA =125˚C, 1000Hrs
10Hz f10kHz
3-Lead TO-263: Control Section/Output Section
3-Lead TO-220: Control Section/Output Section
0.3
1.0
%
0.003
%
0.65/2.7 ˚C/W
0.65/2.7 ˚C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application Notes.
Note 3: The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature
is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations in the Application Notes.
Note 4: For testing purposes, ESD was applied using human body model, 1.5kin series with 100pF.
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: IFULLLOAD is defined in the current limit curves. The IFULLLOAD Curve defines the current limit as a function of input-to-output voltage. Note that 30W power
dissipation for the LM1084 is only achievable over a limited range of input-to-output voltage.
Note 8: Load and line regulation are measured at constant junction temperature, and are guaranteed up to the maximum power dissipation of 30W. Power
dissipation is determined by the input/output differential and the output current. Guaranteed maximum power dissipation will not be available over the full input/output
range.
Note 9: Dropout voltage is specified over the full output current range of the device.
Note 10: The minimum output current required to maintain regulation.
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