L4949DR2G View Datasheet(PDF) - ON Semiconductor
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L4949DR2G Datasheet PDF : 10 Pages
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L4949, NCV4949
PACKAGE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 626−05
ISSUE L
NOTE 2
8
5
1
4
F
−A−
−B−
−T−
SEATING
PLANE
H
C
N
D
K
G
0.13 (0.005) M T A M B M
L
J
M
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G
2.54 BSC
0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L
7.62 BSC
0.300 BSC
M −−− 10_ −−− 10_
N 0.76 1.01 0.030 0.040
SOIC−20 WB
DW SUFFIX
CASE 751D−05
ISSUE G
D
A
q
20
11
E
1
10
20X B
B
0.25 M T A S B S
18X e
A
SEATING
PLANE
A1 T
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e
1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q
0_ 7_
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