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FM160 View Datasheet(PDF) - Jiangsu Yutai Electronics Co., Ltd

Part Name
Description
View to exact match
FM160
CHENDA
Jiangsu Yutai Electronics Co., Ltd CHENDA
FM160 Datasheet PDF : 5 Pages
1 2 3 4 5
FM120 THRU FM1200
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5oC~40oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
TL
TL
Tsmax
Critical Zone
TL to TP
Ts m i n
tS
Preheat
Ramp-down
25
t25oC to Peak
Time
3.Reflow soldering
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
Tsmax to TL
-Ramp-upRate
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(TP)
Time within 5oC of actual Peak
Temperature(tP)
Ramp-down Rate
Time 25oC to Peak Temperature
Soldering Condition
<3oC/sec
150oC
200oC
60~120sec
<3oC/sec
217oC
60~260sec
255oC-0/+5oC
10~30sec
<6oC/sec
<6minutes
2014-03 01版
http://www.microdiode.com
 

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