datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

BCP56,115 View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
View to exact match
BCP56,115
NXP
NXP Semiconductors. NXP
BCP56,115 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
BC639; BCP56; BCX56
80 V, 1 A NPN medium power transistors
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
BC639
BCP56
Conditions
in free air
BCX56
Rth(j-sp)
thermal resistance from
junction to solder point
BC639
BCP56
BCX56
Min Typ Max Unit
[1] -
-
150 K/W
[1] -
-
195 K/W
[2] -
-
130 K/W
[1] -
-
250 K/W
[2] -
-
145 K/W
[3] -
-
100 K/W
-
-
40
K/W
-
-
17
K/W
-
-
30
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
103
006aaa088
Zth(j-a)
(K/W)
102
duty cycle =
1
0.75
0.5
0.33
0.2
0.1
10 0.05
0.02
0.01
0
1
105
104
103
102
101
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT54;
typical values
BC639_BCP56_BCX56_8
Product data sheet
Rev. 08 — 22 June 2007
© NXP B.V. 2007. All rights reserved.
6 of 15
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]