Data Sheet
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 25. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
TOP VIEW
1.00 12° MAX
0.85
0.80
SEATING
PLANE
0.80 MAX
0.65 TYP
0.30
0.23
0.18
0.60 MAX
0.60 MAX
3.75
BCS SQ
0.50
BSC
0.75
0.60
0.50
15 16
20
1
EXPOSED
PAD
5
10
6
11
BOTTOM VIEW
PIN 1
INDICATOR
2.25
2.10 SQ
1.95
0.25 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 26. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-1)
Dimensions shown in millimeters
ADF4106
Rev. E | Page 21 of 24