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P0302E1004FBT View Datasheet(PDF) - Vishay Semiconductors

Part Name
Description
View to exact match
P0302E1004FBT Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
www.vishay.com
P
Vishay Sfernice
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged Terminations
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heatsink
(see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA
Arrays, CHP Thick Film) www.vishay.com/doc?53048.
Option to order 0063: (applies to size 1206/1505/2010).
DIMENSIONS (Option 0063) in millimeters
Enlarged
termination
Bottom view for mounting
A
Uncoatted
ceramic
B
F
D
E
CASE SIZE
1206
1505
2010
2512
A
MAX. TOL.
+0.152
MIN. TOL.
-0.152
NOMINAL
3.06
3.81
5.08
6.30
B
MAX. TOL.
+0.127
MIN. TOL.
-0.127
NOMINAL
1.60
1.32
2.54
3.30
E
MAX. TOL.
+0.13
MIN. TOL.
-0.13
NOMINAL
0.40
0.48
D
MAX. TOL.
+0.13
MIN. TOL.
-0.13
NOMINAL
1.215
1.59
2.215
2.835
NOMINAL
0.63
SUGGESTED LAND PATTERN (Option 0063)
F
MIN.
0.50
MAX.
0.76
Gmin.
Zmax.
Xmax.
CHIP SIZE
1206
1505
2010
2512
Zmax.
3.91
4.66
5.93
7.15
DIMENSIONS (IN MILLIMETER)
Gmin.
0.50
Xmax.
1.73
1.45
2.67
3.43
Revision: 05-May-17
5
Document Number: 53017
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 

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