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CA0508KPY5V0BB121 View Datasheet(PDF) - YAGEO Corporation

Part Name
Description
View to exact match
CA0508KPY5V0BB121
YAGEO
YAGEO Corporation YAGEO
CA0508KPY5V0BB121 Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
Surface-Mount Ceramic Multilayer Capacitors 4C-Array
NP0/X7R/Y5V
Product specification 14
16 V to 50 V
17
TEST
Bond
Strength of
Plating on
End Face
TEST METHOD PROCEDURE
IEC 60384- 4.8 Mounting in accordance with IEC 60384-22
21/22
paragraph 4.3
Conditions: bending 1 mm at a rate of 1 mm/s,
radius jig 5 mm
REQUIREMENTS
No visible damage
Δ C/C Class 1:
NP0: within ± 1% or 0.5 pF, whichever is greater
Class2:
X5R/X7R/Y5V: ± 10%
Resistance to
Soldering
Heat
Solderability
4.9 Precondition: 150 +0/10 °C for 1 hour, then
Dissolution of the end face plating shall not
keep for 24 ± 1 hours at room temperature
exceed 25% of the length of the edge
Preheating: for size 1206: 120 °C to 150 °C for concerned
1 minute
Preheating: for size >1206: 100 °C to 120 °C for
1 minute and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ± 5 °C
Dipping time: 10 ± 0.5 seconds
Recovery time: 24 ± 2 hours
Δ C/C Class 1:
NP0: within ± 0.5% or 0.5 pF, whichever is
greater
Class2:
X5R/X7R: ± 10% Y5V: ± 20%
D.F. within initial specified value
Rins within initial specified value
4.10 Preheated the temperature of 80 °C to 140 °C
and maintained for 30 seconds to 60 seconds.
The solder should cover over 95% of the critical
area of each termination
Test conditions for lead containing solder alloy
Temperature: 235 ± 5 °C
Dipping time: 2 ± 0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for leadfree containing solder alloy
Temperature: 245 ± 5 °C
Dipping time: 3 ± 0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
Nov. 10, 2015 V.4
www.yageo.com
 

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