MT29F64G08CFABAWP View Datasheet(PDF) - Micron Technology

Part Name

Description

View to exact match

MT29F64G08CFABAWP

Asynchronous/Synchronous NAND NAND Flash Memory / 52-pad LGA / 48-pin TSOP / 100-ball BGA

Micron Technology 

Micron Confidential and Proprietary

32Gb, 64Gb, 128Gb, 256Gb Asynchronous/Synchronous NAND

Package Dimensions

Figure 9: 100-Ball LBGA – 12mm x 18mm (Package Code: H3)

Seating

plane

0.12 A A

0.98 ±0.05

100X Ø0.45

Solder ball material:

SAC305 (96.5% Sn,

3% Ag, 0.5% Cu).

Dimensions apply to

solder balls post-

reflow on Ø0.40 SMD

ball pads.

16 CTR 10 CTR

12 ±0.1

10 9 8 7 6 5 4 3 2 1

Ball A1 ID

A

B

D

E

F

G

H

J 18 ±0.1

K

L

M

N

P

Ball A1 ID

T

1 TYP

U

1 TYP

9 CTR

1.4 MAX

Bottom side

saw fiducials

0.25 MIN

may or may not

be covered with soldermask.

Note: 1. All dimensions are in millimeters.

PDF: 09005aef836c9ded

Rev. F 12/09 EN

18

Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 2008 Micron Technology, Inc. All rights reserved.

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