Micron Confidential and Proprietary
32Gb, 64Gb, 128Gb, 256Gb Asynchronous/Synchronous NAND
Package Dimensions
Figure 8: 100-Ball TBGA – 12mm x 18mm (Package Code: H2)
Seating
plane
0.12 A A
0.73 ±0.05
100X Ø0.45
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.4 SMD ball pads.
12 ±0.1
10 9 8 7 6 5 4 3 2 1
Ball A1 ID
A
B
8
7
16 CTR
1 TYP
D
E
F
G
H
J 18 ±0.1
K
L
M
N
P
T
U
Bottom side
fiducials may
or may not be
covered with
soldermask.
1 TYP
1 TYP
9 CTR
Note: 1. All dimensions are in millimeters.
Ball A1 ID
1.2 MAX
0.25 MIN
PDF: 09005aef836c9ded
Rev. F 12/09 EN
17
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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