MT29F64G08CFABAWP View Datasheet(PDF) - Micron Technology

Part Name

Description

View to exact match

MT29F64G08CFABAWP

Asynchronous/Synchronous NAND NAND Flash Memory / 52-pad LGA / 48-pin TSOP / 100-ball BGA

Micron Technology 

Micron Confidential and Proprietary

32Gb, 64Gb, 128Gb, 256Gb Asynchronous/Synchronous NAND

Package Dimensions

Figure 6: 52-Pad VLGA

See Detail B

Section A–A

40X Ø0.71

12X Ø11

6 CTR

4 CTR

8

7654 321

0

Seating

plane

A

0.1 A

See Note 1

Detail B2

Not to scale

Terminal

A1 ID

Substrate material: plastic laminate.

Mold compound: epoxy novolac.

Terminal A1 ID

OA

OB

OC

13 12 10

A

CTR CTR CTR

2

TYP OD

OE

OF

A

B

C

D

E

FA

G

18 ±0.1

H

J

K

L

M2

N TYP

2 TYP

10 CTR

14 ±0.1

1.0 MAX

including package bow.

Bottom side saw fiducials may or

may not be covered with soldermask.

Notes: 1. Pads are nonsolder mask defined (NSMD) and are plated with 3–15 microns of nickel

followed by a minimum of 0.1 microns of soft wire bondable gold (99.99% pure).

2. Primary datum A (seating plane) is defined by the bottom terminal surface.

Terminals need not extend below the package bottom surface.

Note: 1. All dimensions are in millimeters.

PDF: 09005aef836c9ded

Rev. F 12/09 EN

15

Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 2008 Micron Technology, Inc. All rights reserved.

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