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29F128G08CEAAA View Datasheet(PDF) - Micron Technology

Part Name
Description
View to exact match
29F128G08CEAAA
Micron
Micron Technology Micron
29F128G08CEAAA Datasheet PDF : 159 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Micron Confidential and Proprietary
Advance
64Gb, 128Gb, 256Gb, 512Gb Asynchronous/Synchronous NAND
Features
NAND Flash Memory
MT29F64G08CBAAA, MT29F128G08C[E/F]AAA,
MT29F256G08C[J/K/M]AAA, MT29F512G08CUAAA,
MT29F64G08CBCAB, MT29F128G08CECAB, MT29F256G08C[K/M]CAB,
MT29F512G08CUCAB
Features
Open NAND Flash Interface (ONFI) 2.2-compliant1
Multiple-level cell (MLC) technology
Organization
Page size x8: 8640 bytes (8192 + 448 bytes)
Block size: 256 pages (2048K + 112K bytes)
Plane size: 2 planes x 2048 blocks per plane
Device size: 64Gb: 4096 blocks;
128Gb: 8192 blocks;
256Gb: 16,384 blocks;
512Gb: 32,786 blocks
Synchronous I/O performance
Up to synchronous timing mode 5
Clock rate: 10ns (DDR)
Read/write throughput per pin: 200 MT/s
Asynchronous I/O performance
Up to asynchronous timing mode 5
tRC/tWC: 20ns (MIN)
Array performance
Read page: 50µs (MAX)
Program page: 1300µs (TYP)
Erase block: 3ms (TYP)
Operating Voltage Range
VCC: 2.7–3.6V
VCCQ: 1.7–1.95V, 2.7–3.6V
Command set: ONFI NAND Flash Protocol
Advanced Command Set
Program cache
Read cache sequential
Read cache random
One-time programmable (OTP) mode
Multi-plane commands
Multi-LUN operations
Read unique ID
Copyback
First block (block address 00h) is valid when ship-
ped from factory. For minimum required ECC, see
Error Management (page 109).
RESET (FFh) required as first command after power-
on
Operation status byte provides software method for
detecting
Operation completion
Pass/fail condition
Write-protect status
Data strobe (DQS) signals provide a hardware meth-
od for synchronizing data DQ in the synchronous
interface
Copyback operations supported within the plane
from which data is read
Quality and reliability
Data retention: 10 years
Endurance: 5000 PROGRAM/ERASE cycles
Operating temperature:
Commercial: 0°C to +70°C
Industrial (IT): –40ºC to +85ºC
Package
52-pad LGA
48-pin TSOP
100-ball BGA
Note: 1. The ONFI 2.2 specification is available at
www.onfi.org.
PDF: 09005aef83d2277a
Rev. A 11/09 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2009 Micron Technology, Inc. All rights reserved.
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications.
 

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