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29F64G08CBAAA View Datasheet(PDF) - Micron Technology

Part Name
Description
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29F64G08CBAAA
Micron
Micron Technology Micron
29F64G08CBAAA Datasheet PDF : 159 Pages
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Micron Confidential and Proprietary
Advance
64Gb, 128Gb, 256Gb, 512Gb Asynchronous/Synchronous NAND
Package Dimensions
Figure 9: 100-Ball LBGA – 12mm x 18mm (Package Code: H3)
Seating
plane
0.12 A A
1.03 ±0.05
100X Ø0.45
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.4 SMD ball pads.
12 ±0.1
10 9 8 7 6 5 4 3 2 1
Ball A1 ID
A
B
8
7
16 CTR
1 TYP
D
E
F
G
H
J 18 ±0.1
K
L
M
N
P
Ball A1 ID
T
U
1 TYP
1 TYP
9 CTR
1.4 MAX
Bottom side
saw fiducials
0.25 MIN
may or may not
be covered with soldermask.
Note: 1. All dimensions are in millimeters.
PDF: 09005aef83d2277a
Rev. A 11/09 EN
18
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2009 Micron Technology, Inc. All rights reserved.
 

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