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Z0402SF View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
Z0402SF
ST-Microelectronics
STMicroelectronics ST-Microelectronics
Z0402SF Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Package information
Z04
3
Package information
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
10.1
0.398
A
C
7.3
0.287
D
C
F
O
H
FD J
J
P
H
M
N1
N
N
M
N1
O
10.5
1.5
0.51
1.5
4.5
5.3
2.54
1.4
0.413
0.059
0.020
0.059
0.177
0.209
0.100
0.055
P
0.7
0.028
In order to meet environmental requirements, ST offers these devices in ECOPACKĀ®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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