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X00619 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
X00619
ST-Microelectronics
STMicroelectronics ST-Microelectronics
X00619 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
X00619
Characteristics
Table 5. Thermal resistances
Symbol
Rth(j-l)
Rth(j-c)
Junction to leads (DC)
Junction to case (DC)
Rth(j-a) Junction to ambient (DC)
Parameter
S = 5 cm2
TO-92
SOT-223
TO-92
SOT-223
Max.
Value
70
30
150
60
Unit
°C/W
Figure 1.
Maximum average power
dissipation versus average
on-state current
0.6 P(W)
α = 30°, 60° °,°90° °, 1° 20° °,DC180°, DC
0.4
Figure 2. Average and DC on-state current
versus case temperature (SOT-223)
IT(AV)(A)
1.0
SOT-223
0.8
0.6
α = 30°, 60°, 90°, 120°, 180°, DC
0.4
0.2
360°
0.2
IT(AV)(A)
α
0.0
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0
Tl(°C)
25
50
75
100
125
Figure 3. Average and DC on-state current
versus lead temperature (TO-92)
IT(AV)(A)
1.0
TO-92
0.8
α = 30°, 60°, 90°, 120°, 180°, DC
Figure 4.
Average and DC on-state current
versus ambient temperature (free
air convection)
IT(AV)(A)
1.0
DC
0.8
SOT-223
SCU= 5 cm²
0.6
0.6
0.4
0.4
0.2
0.0
0
0.2
Tl(°C)
0.0
25
50
75
100
125
0
α = 180°
Tamb(°C)
TO-92
SCU= 0.5 cm²
25
50
75
100
125
Doc ID 15755 Rev 2
3/10
 

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