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X00602MA1AA2 View Datasheet(PDF) - STMicroelectronics

Part NameDescriptionManufacturer
X00602MA1AA2 0.8 A sensitive gate SCRs ST-Microelectronics
STMicroelectronics ST-Microelectronics
X00602MA1AA2 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Characteristics
X006
Figure 5.
Average and DC on-state current Figure 6.
versus ambient temperature (epoxy
PCB FR4, copper
thickness = 35 µm, SCU = 5 cm2)
(SOT-223)
Relative variation of thermal
impedance junction to ambient
versus pulse duration (PCB FR4,
copper thickness = 35 µm, SCU = 0.5
cm2) (TO-92)
IT(AV)(A)
1.0
0.9
D.C.
0.8
0.7
0.6
α = 180°
0.5
0.4
0.3
0.2
0.1
0.0
0
25
SOT-223
SCU = 0.5 cm2
Zth(j-a)/Rth(j-a)
1.00
TO-92
SCU = 0.5 cm2
0.10
Tamb(°C)
50
75
tp(s)
0.01
100
125
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 7.
Relative variation of thermal
Figure 8.
impedance junction to ambient
versus pulse duration (PCB FR4,
copper thickness = 35 µm, SCU = 0.5
cm2) (SOT-223)
Thermal resistance junction to
ambient versus copper surface
under tab (PCB FR4, copper
thickness = 35 µm) (SOT-223)
Zth(j-a)/Rth(j-a)
1.00
SOT-223
SCU = 0.5 cm2
0.10
0.01
1.E-03
1.E-02
1.E-01
tp(s)
1.E+00
1.E+01
1.E+02
1.E+03
Rth(j-a)(°C/W)
130
120
110
100
90
80
70
60
50
40
30
20
10
S(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 9.
Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
1.6
1.4
1.2
1.0
IH & IL
0.8
0.6
IGT
0.4
0.2
Tj(°C)
0.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
Figure 10. Relative variation of holding
current versus gate-cathode
resistance (typical values)
IH[RGK] / IH[RGK=1kΩ]
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.E-02
1.E-01
RGK(kΩ)
1.E+00
1.E+01
1.E+02
4/9
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