datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

WM8850 View Datasheet(PDF) - Wolfson Microelectronics plc

Part Name
Description
View to exact match
WM8850
Wolfson
Wolfson Microelectronics plc Wolfson
WM8850 Datasheet PDF : 223 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
WM8850
Pre-Production
THERMAL PERFORMANCE
Thermal analysis should be performed in the intended application to prevent the WM8850 from
exceeding maximum junction temperature. Several contributing factors affect thermal performance
most notably the physical properties of the mechanical enclosure, location of the device on the PCB
in relation to surrounding components and the number of PCB layers. Connecting the GND paddle
through thermal vias and into a large ground plane will aid heat extraction.
Three main heat transfer paths exist to surrounding air as illustrated below in Figure 1:
- Package top to air (radiation).
- Package bottom to PCB (radiation).
- Package leads & paddle to PCB (conduction).
Figure 1 Heat Transfer Paths
The temperature rise TR is given by TR = PD * ӨJA
- PD is the power dissipated in the device.
- ӨJA is the thermal resistance from the junction of the die to the ambient temperature
and is therefore a measure of heat transfer from the die to surrounding air. ӨJA is
determined with reference to JEDEC standard JESD51-9.
The junction temperature TJ is given by TJ = TA +TR, where TA is the ambient temperature.
PARAMETER
Operating temperature range
Operating junction temperature
Thermal Resistance
SYMBOL
TA
TJ
ӨJA
MIN
TYP
MAX
UNIT
-40
85
°C
-40
125
°C
29
°C/W
w
PP, April 2011, Rev 3.2
12
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]