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W25Q64CVSSI View Datasheet(PDF) - Winbond

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W25Q64CVSSI Datasheet PDF : 80 Pages
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W25Q64CV
Table of Contents
1. GENERAL DESCRIPTION ............................................................................................................... 5
2. FEATURES....................................................................................................................................... 5
3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 6
3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6
3.2 Pad Configuration WSON 6x5-mm / 8X6-mm...................................................................... 6
3.3 Pin Configuration PDIP 300-mil............................................................................................ 7
3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil .................... 7
3.5 Pin Configuration SOIC 300-mil ........................................................................................... 8
3.6 Pin Description SOIC 300-mil............................................................................................... 8
3.7 Ball Configuration TFBGA 8x6-mm ...................................................................................... 9
3.8 Ball Description TFBGA 8x6-mm ......................................................................................... 9
4. PIN DESCRIPTIONS ...................................................................................................................... 10
4.1 Chip Select (/CS)................................................................................................................ 10
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................. 10
4.3 Write Protect (/WP)............................................................................................................. 10
4.4 HOLD (/HOLD) ................................................................................................................... 10
4.5 Serial Clock (CLK) .............................................................................................................. 10
5. BLOCK DIAGRAM .......................................................................................................................... 11
6. FUNCTIONAL DESCRIPTIONS..................................................................................................... 12
6.1 SPI OPERATIONS ............................................................................................................. 12
6.1.1 Standard SPI Instructions .....................................................................................................12
6.1.2 Dual SPI Instructions ............................................................................................................12
6.1.3 Quad SPI Instructions ...........................................................................................................12
6.1.4 Hold Function........................................................................................................................12
6.2 WRITE PROTECTION ....................................................................................................... 13
6.2.1 Write Protect Features ..........................................................................................................13
7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 14
7.1 STATUS REGISTERS........................................................................................................ 14
7.1.1 BUSY Status (BUSY)............................................................................................................14
7.1.2 Write Enable Latch Status (WEL) .........................................................................................14
7.1.3 Block Protect Bits (BP2, BP1, BP0) ......................................................................................14
7.1.4 Top/Bottom Block Protect Bit (TB) ........................................................................................14
7.1.5 Sector/Block Protect Bit (SEC) .............................................................................................14
7.1.6 Complement Protect Bit (CMP).............................................................................................15
7.1.7 Status Register Protect Bit (SRP1, SRP0)............................................................................15
7.1.8 Erase/Program Suspend Status (SUS).................................................................................15
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