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W24512 View Datasheet(PDF) - Winbond

Part NameDescriptionManufacturer
W24512 64K X 8 HIGH SPEED CMOS STATIC RAM Winbond
Winbond Winbond
W24512 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
W24512A
PACKAGE DIMENSIONS
32-pin P-DIP
32
1
E
1
S
2
AA
L
D
17
B
e1
B1
16
E
1
A Base Plane
Seating Plane
a
eA
Dimension in Inches Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
0.210
5.33
A1 0.010
0.25
A2 0.150 0.155 0.160 3.81 3.94 4.06
B
0.016 0.018 0.022 0.41 0.46 0.56
B1 0.048 0.050 0.054 1.22 1.27 1.37
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.650 1.660
41.91 42.16
E
0.590 0.600 0.610 14.99 15.24 15.49
E1
0.540 0.550 0.555 13.84 13.97 14.10
e 1 0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.02
S
0.085
2.16
Notes:
1. Dimension D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
c
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
32-pin SO Wide Body
32
17
E
EH
1
b 16
D
S
y
Seating Plane
2
A
A
e
1
A
e1
L
Detail F
e1
c
LE
See Detail F
Symbol Dimension in Inches
Dimension in mm
Min. Nom. Max. Min. Nom. Max.
A
0.118
3.00
A1
0.004
0.10
A2
0.101 0.106 0.111 2.57 2.69 2.82
b
0.014 0.016 0.020 0.36 0.41 0.51
c
0.006 0.008 0.012 0.15 0.20 0.31
D
0.805 0.817
20.45 20.75
E
0.440 0.445 0.450 11.18 11.30 11.43
e
0.044 0.050 0.056 1.12 1.27 1.42
HE
0.546 0.556 0.556 13.87 14.12 14.38
L
0.023 0.031 0.039 0.58 0.79 0.99
LE
0.047 0.055 0.063 1.19 1.40 1.60
S
0.036
0.91
y
0.004
0.10
θ
0
10
0
10
Notes:
1. Dimension D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. DanimdeanrseiodnetDer&miEneindc. alutdtehemmolodldmpisamrtaintgchline.
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
-8-
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