ULN2002 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

View to exact match

ULN2002

Seven darlington array

STMicroelectronics 

ULN200xA - ULN200xD1

6

Package mechanical data

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

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