UC1608XFAC View Datasheet(PDF) - Unspecified

Part Name

Description

View to exact match

UC1608XFAC

128x240 Matrix LCD Controller-Drivers

Unspecified 

ULTRACHIP

High-Voltage Mixed-Signal IC

ORDERING INFORMATION

Product ID

UC1608xGAC

UC1608xFAC

Description

Gold bumped die.

COF packaging.

©1999-2002

General Notes

APPLICATION INFORMATION

For improved readability, the specification contains many application data points. When application information is given, it

is advisory and does not form part of the specification for the device.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of

ninety (90) days from the date of UltraChip’s delivery. There is no post waffle saw/pack testing performed on individual die.

Although the latest modern processes are utilized for wafer sawing and die pick-&-place into waffle pack carriers,

UltraChip has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, it is the

responsibility of the customer to test and quality their application in which the die is to be used. UltraChip assumes no

liability for device functionality or performance of the die or systems after handling, packing or assembly of the die.

LIFE SUPPORT APPLICATIONS

These devices are not designed for use in life support appliances, or systems where malfunction of these products can

reasonably be expected to result in personal injuries. Customer using or selling these products for use in such

applications do so at their own risk.

2

Revision 0.52

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