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UBA2024AP View Datasheet(PDF) - NXP Semiconductors.

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Description
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UBA2024AP
NXP
NXP Semiconductors. NXP
UBA2024AP Datasheet PDF : 14 Pages
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NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
9. Thermal characteristics
Table 4.
Symbol
Rth(j-a)
Rth(j-c)
Thermal characteristics
Parameter
thermal resistance from junction
to ambient
thermal resistance from junction
to case
Conditions
in free air
SO14 package
DIP8 package
in free air
SO14 package
DIP8 package
[1] In accordance with IEC 60747-1
10. Characteristics
Typ
[1]
95
95
[1]
8
16
Unit
K/W
K/W
K/W
K/W
Table 5. Characteristics
Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
High-voltage supply
VHV
voltage on pin HV
mains transients during
0
-
550
V
0.5 s; IHV < 30 mA
VFS
voltage on pin FS
mains transients during
0
-
564
V
0.5 s; IHV < 30 mA
Low-voltage supply
VDD
supply voltage
VHV = 100 V; ROSC = ;
11.7
12.5
13.3
V
VSW = VDD; VRC = 0 V
Start-up state
IHV
current on pin HV
VHV = 100 V; ROSC = ;
-
-
0.39
mA
VSW = VDD; VRC = 0 V
VDD(startup) start-up supply voltage
10
11
12
V
VDD(stop)
VDD(hys)
stop supply voltage
hysteresis of supply voltage
8
8.5
9
V
2
2.5
3
V
Output stage
Ron
on-state resistance
HS transistor; VHV = 310 V; ID = 100 mA
UBA2024P
-
9.7
11
UBA2024AP
-
6.5
7.4
UBA2024T
-
9.7
11
UBA2024AT
-
7.0
8.0
LS transistor; ID = 100 mA
UBA2024P
-
8.5
9.4
UBA2024AP
-
5.7
6.3
UBA2024T
-
8.5
9.4
UBA2024AT
-
6.2
6.9
UBA2024_4
Product data sheet
Rev. 04 — 17 September 2009
© NXP B.V. 2009. All rights reserved.
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