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TS944BIDT View Datasheet(PDF) - STMicroelectronics

Part NameDescriptionManufacturer
TS944BIDT Output rail-to-rail micropower operational amplifiers ST-Microelectronics
STMicroelectronics ST-Microelectronics
TS944BIDT Datasheet PDF : 19 Pages
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Package information
3
Package information
TS941 TS942 TS944
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
3.1
SOT23-5 package information
Figure 17. SOT23-5 package mechanical drawing
10/19
Table 6.
Ref.
A
A1
A2
b
C
D
E
E1
e
e1
L
SOT23-5 package mechanical data
Dimensions
Millimeters
Min.
0.90
0.00
0.90
0.35
0.09
2.80
2.60
1.50
0.35
Typ.
0.95
1.9
Max.
1.45
0.15
1.30
0.50
0.20
3.00
3.00
1.75
Min.
35.4
0.00
35.4
13.7
3.5
110.2
102.3
59.0
0.55
13.7
Mils
Typ.
37.4
74.8
Max.
57.1
5.9
51.2
19.7
7.8
118.1
118.1
68.8
21.6
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