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TS68040MR1U25A View Datasheet(PDF) - Atmel Corporation

Part NameDescriptionManufacturer
TS68040MR1U25A Third-Generation 32-bit Microprocessor Atmel
Atmel Corporation Atmel
TS68040MR1U25A Datasheet PDF : 49 Pages
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TS68040
Table 12. Electrical Characteristics (Continued)
-55°C TC TJmax; 4.75V VCC 5.25V unless otherwise specified(1)(2)(3)(4)
Symbol
Characteristic
Min
Max
Unit
VOL
Output Low Voltage
Larger buffers - IOL = 35 mA
Small buffers - IOL = 5 mA
PD
Power Dissipation (TJ = 125°C)
Larger Buffers Enabled
Small Buffers Enabled
0.5
V
7.7
6.3
W
Cin
Capacitance - Note 4
Vin = 0V, f = 1 MHz
25
pF
Notes: 1. All testing to be performed using worst-case test conditions unless otherwise specified.
2. Maximum operating junction temperature (TJ) = +125°. Minimum case operating temperature (TC) = -55°. This device is not
tested at TC = +125°. Testing is performed by setting the junction temperature TJ = +125°and allowing the case and ambient
temperatures to rise and fall as necessary so as not to exceed the maximum junction temperature.
3. Capacitance is periodically sampled rather than 100% tested.
4. Power dissipation may vary in between limits depending on the application.
Dynamic Characteristics
Table 13. Clock AC Timing Specifications (see Figure 8)
-55°C TC TJmax; 4.75V VCC 5.25V unless otherwise specified(1)(2)(3)(4)
25 MHz
33 MHz
Num
Characteristic
Min
Max
Min
Max
Unit
Frequency of Operation
20
25
20
33
MHz
1
PCLK Cycle Time
2
PCLK Rise Time(4)
3
PCLK Fall Time(4)
4
PCLK Duty Cycle Measured at 1.5V(4)
4a
PCLK Pulse Width High Measured at 1.5V(3)(4)
4b
PCLK Pulse Width Low Measured at 1.5V(3)(4)
20
25
15
25
ns
1.7
1.7
ns
1.6
1.6
ns
47.5
52.5 46.67 53.33
%
9.5
10.5
7
8
ns
9.5
10.5
7
8
ns
5
BCLK Cycle Time
40
50
30
60
ns
6, 7 BCLK Rise and Fall Time
8
BCLK Duty Cycle Measured at 1.5V(4)
8a
BCLK Pulse Width High Measured at 1.5V(4)
8b
BCLK Pulse Width Low Measured at 1.5V(4)
9
PCLK, BCLK Frequency Stability(4)
4
3
ns
40
60
40
60
%
16
24
12
18
ns
16
24
12
18
ns
1000
1000
ppm
10
Notes:
PCLK to BCLK Skew
9
n/a
ns
1. All testing to be performed using worst-case test conditions unless otherwise specified.
2. Maximum operating junction temperature (TJ) = +125°. Minimum case operating temperature (TC) = -55°. This device is not
tested at TC = +125°. Testing is performed by setting the junction temperature TJ = +125°and allowing the case and ambient
temperatures to rise and fall as necessary so as not to exceed the maximum junction temperature.
3. Specification value at maximum frequency of operation.
4. If not tested, shall be guaranteed to the limits specified.
19
2116A–HIREL–09/02
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