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|Description||Third-Generation 32-bit Microprocessor|
|TS68040MRD/T25A Datasheet PDF : 49 Pages |
Is in accordance with MIL-M-38535 and method 5005 of MIL-STD-883. Group A and B
inspections are performed on each production lot. Groups C and D inspection are per-
formed on a periodical basis.
All static and dynamic electrical characteristics specified for inspection purposes and the
relevant measurement conditions are given below:
• Table 12: Static electrical characteristics for the electrical variants.
• Table 13: Dynamic electrical characteristics for TS68040 (25 MHz, 33 MHz).
For static characteristics (Table 12), test methods refer to IEC 748-2 method number,
For dynamic characteristics (Table 13), test methods refer to clause “Static Characteris-
tics” on page 18 of this specification.
Indication of “min.” or “max.” in the column «test temperature» means minimum or max-
imum operating temperature as defined in sub-clause Table 5 here above.
Table 12. Electrical Characteristics
-55°C ≤TC ≤TJmax; 4.75V ≤VCC ≤5.25V unless otherwise specified(1)(2)(3)(4)
Input High Voltage
Input Low Voltage
Input Leakage Current
AVEC, BCLK BG, CDIS,
IPLn, MDIS, PCLK, RSTI, SCn,
TBI, TCI, TCK, TEA
Hi-z (Off-state) Leakage Current
An, BB, CIOUT, Dn, LOCK,
LOCKE, R/W, SIZn, TA, TDO,
TIP, TLNn, TMn, TS, TTn, UPAn
Signal Low Input Current
VIL = 0.8V
Signal High Input Current
VIH = 2.0V
Output High Voltage
Larger Buffers - IOH = 35 mA
Small Buffers - IOH = 5 mA
TMS, TDI, TRST
TMS, TDI, TRST
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