datasheetbank_Logo    Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site
Part Name :

TS68040MRD/T25A View Datasheet(PDF) - Atmel Corporation

Part NameTS68040MRD/T25A Atmel
Atmel Corporation Atmel
DescriptionThird-Generation 32-bit Microprocessor
TS68040MRD/T25A Datasheet PDF : 49 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
Table 9. Thermal Parameters With Heat Sink and No Air Flow
Thermal Mgmt.
Technique
Defined Parameters
Heat Sink
PD
TJ
ΦJC
2338B
3W
125°C
1°C/W
2338B
5W
125°C
1°C/W
Measured
ΦJA
14°C/W
14°C/W
ΦCA
13°C/W
13°C/W
Calculated
TC
122°C
120°C
TA
83°C
55°C
Thermal Characteristics with
a Heat Sink
and Forced Air
A sample size of three TS68040 packages was tested in forced-air cooling in a wind tun-
nel with a heat sink. This test was performed with 3W of power being dissipated from
within the package. As mentioned previously, the variance in ΦJA within the possible
power range is negligible; it can be assumed for calculation purposes that ΦJA is valid at
all power levels. Table 10 shows the results, assuming a maximum power dissipation at
3 and 5W with air flow and heat sink thermal management (refer to Table 6 to calculate
other power dissipation values).
Table 10. Thermal Parameters with Heat Sink and Air Flow
Thermal Mgmt. Technique
Defined Parameters
Air-flow
Heat sink
PD
TJ
ΦJC
100 LFM
2338B
3W
125°C
1°C/W
250 LFM
2338B
3W
125°C
1°C/W
500 LFM
2338B
3W
125°C
1°C/W
750 LFM
2338B
3W
125°C
1°C/W
1000 LFM
2338B
3W
125°C
1°C/W
100 LFM
2338B
5W
125°C
1°C/W
250 LFM
2338B
5W
125°C
1°C/W
500 LFM
2338B
5W
125°C
1°C/W
750 LFM
2338B
5W
125°C
1°C/W
1000 LFM
2338B
5W
125°C
1°C/W
Measured
ΦJA
3.1°C/W
2.2°C/W
1.7°C/W
1.5°C/W
1.4°C/W
3.1°C/W
2.2°C/W
1.7°C/W
1.5°C/W
1.4°C/W
ΦCA
2.1°C/W
1.2°C/W
0.7°C/W
0.5°C/W
0.4°C/W
2.1°C/W
1.2°C/W
0.7°C/W
0.5°C/W
0.4°C/W
Calculated
TC
122°C
122°C
122°C
122°C
122°C
120°C
120°C
120°C
120°C
120°C
TA
115.7°C
118.4°C
119.9°C
120.5°C
120.8°C
109.5°C
114°C
116.5°C
117.5°C
118°C
Thermal Testing Summary
Testing proved that a heat sink in combination with a relatively small amount of air-flow
(100 LFM or less) will easily realize a 0-70°C ambient operating temperature for the
TS68040 with almost any configuration of the output buffers. A heat sink alone may be
capable of providing all necessary cooling, depending on the particular heat sink
height/size restraints, the maximum ambient operating temperature required, and the
output buffer configuration chosen. Also forced air cooling alone may attain a 0-70°C
ambient operating temperature. However this factor is highly dependent on the output
buffer configuration chosen and the available forced air for cooling. Figure 7 is a sum-
mary of the test results of the relationship between ΦJA and air-flow for the TS68040.
16 TS68040
2116A–HIREL–09/02
Direct download click here
 

Description
The TS68040 is Atmel’s third generation of 68000-compatible, high-performance, 32-bit microprocessors. The TS68040 is a virtual memory microprocessor employing multiple, concurrent execution units and a highly integrated architecture to provide very high performance in a monolithic HCMOS device.

Features
• 26-42 MIPS Integer Performance
• 3.5-5.6 MFLOPS Floating-Point-Performance
• IEEE 754-Compatible FPU
• Independent Instruction and Data MMUs
• 4K bytes Physical Instruction Cache and 4K bytes Physical Data Cache Accessed Simultaneously
• 32-bit, Nonmultiplexed External Address and Data Buses with Synchronous Interface
• User-Object-Code Compatibility with All Earlier TS68000 Microprocessors
• Multimaster/Multiprocessor Support via Bus Snooping
• Concurrent Integer Unit, FPU, MMU, Bus Controller, and Bus Snooper Maximize Throughput
• 4G bytes Direct Addressing Range
• Software Support Including Optimizing C Compiler and UNIX® System V Port
• IEEE P 1149-1 Test Mode (JTAG)
• f = 25 MHz, 33 MHz; VCC = 5V ± 5%; PD = 7W
• The Use of the TS88915T Clock Driver is Suggested

 

Share Link : Atmel
@ 2014 - 2018  [ Home ] [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]