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TS68040MR1U25A View Datasheet(PDF) - Atmel Corporation

Part NameTS68040MR1U25A Atmel
Atmel Corporation Atmel
DescriptionThird-Generation 32-bit Microprocessor
TS68040MR1U25A Datasheet PDF : 49 Pages
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By reviewing the maximum ambient operating temperatures, it can be seen that by
using the all-small-buffer configuration of the TS68040 with a relatively small amount of
air flow (100 LFM), a 0-70°C ambient operating temperature can be achieved. However,
depending on the output buffer configuration and available forced-air cooling, additional
thermal management techniques may be required.
Thermal Characteristics with
a Heat Sink
In choosing a heat sink the designer must consider many factors: heat sink size and
composition, method of attachment, and choice of a wet or dry connection. The follow-
ing paragraphs discuss the relationship of these decisions to the thermal performance of
the design noticed during experimentation.
The heat sink size is one of the most significant parameters to consider in the selection
of a heat sink. Obviously a larger heat sink will provide better cooling. However, it is less
obvious that the most benefit of the larger heat sink of the pin fin type used in the exper-
imentation would be at still air conditions. Under forced-air conditions as low as 100
LFM, the difference between the ΦCA becomes very small (0.4°C/W or less). This differ-
ence continues to decrease as the forced air flow increases. The particular heat sink
used in our testing fit the perimeter package surface area available within the capacitor
pads on the TS68040 (1.48" x 1.48") and showed a nice compromise between height
and thermal performance needs. The heat sink base perimeter area was 1.24" x 1.30"
and its height was 0.49". It was a pin-fin-type (i.e. bed of nails) design composed of Al
alloy. The heat sink is shown in Figure 5 can be obtained through Thermalloy Inc. by ref-
erencing part number 2338B.
Figure 5. Heat Sink Example
14 TS68040
2116A–HIREL–09/02
Direct download click here

Description
The TS68040 is Atmel’s third generation of 68000-compatible, high-performance, 32-bit microprocessors. The TS68040 is a virtual memory microprocessor employing multiple, concurrent execution units and a highly integrated architecture to provide very high performance in a monolithic HCMOS device.

Features
• 26-42 MIPS Integer Performance
• 3.5-5.6 MFLOPS Floating-Point-Performance
• IEEE 754-Compatible FPU
• Independent Instruction and Data MMUs
• 4K bytes Physical Instruction Cache and 4K bytes Physical Data Cache Accessed Simultaneously
• 32-bit, Nonmultiplexed External Address and Data Buses with Synchronous Interface
• User-Object-Code Compatibility with All Earlier TS68000 Microprocessors
• Multimaster/Multiprocessor Support via Bus Snooping
• Concurrent Integer Unit, FPU, MMU, Bus Controller, and Bus Snooper Maximize Throughput
• 4G bytes Direct Addressing Range
• Software Support Including Optimizing C Compiler and UNIX® System V Port
• IEEE P 1149-1 Test Mode (JTAG)
• f = 25 MHz, 33 MHz; VCC = 5V ± 5%; PD = 7W
• The Use of the TS88915T Clock Driver is Suggested

 

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