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TS68040MFU25A View Datasheet(PDF) - Atmel Corporation

Part NameTS68040MFU25A Atmel
Atmel Corporation Atmel
DescriptionThird-Generation 32-bit Microprocessor
TS68040MFU25A Datasheet PDF : 49 Pages
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TS68040
Thermal Characteristics in
Still Air
A sample size of three TS68040 packages was tested in free-air cooling with no heat
sink. Measurements showed that the average ΦJA was 22.8°C/W with a standard devia-
tion of 0.44°C/W. The test was performed with 3W of power being dissipated from within
the package. The test determined that ΦJA will decrease slightly for the increasing power
dissipation range possible. Therefore, since the variance in ΦJA within the possible
power dissipation range is negligible, it can be assumed for calculation purposes that
ΦJA is valid at all power levels. Using the formulas introduced previously, Table 7 shows
the results of a maximum power dissipation of 3 and 5W with no heat sink or air-flow
(refer to Table 6 to calculate other power dissipation values).
Table 7. Thermal Parameters With No Heat Sink or Air-flow
Defined Parameters
Measured
PD
3 Watts
TJ
125°C
ΦJC
1°C/W
ΦJA
21.8°C/W
5 Watts
125°C
1°C/W
21.8°C/W
ΦCA = ΦJA - ΦJC
20.8°C/W
20.8°C/W
Calculated
TC = TJ - PD * ΦJC
122°C
120°C
TA = TJ - PD * ΦJA
59.6°C
16°C
As seen by looking at the ambient temperature results, most users will want to imple-
ment some type of thermal management to obtain a more reasonable maximum
ambient temperature.
Thermal Characteristics in
Forced Air
A sample size of three TS68040 packages was tested in forced air cooling in a wind tun-
nel with no heat sink. This test was performed with 3W of power being dissipated from
within the package. As previously mentioned, since the variance in ΦJA within the possi-
ble power range is negligible, it can be assumed for calculation purposes that ΦJA is
constant at all power levels. Using the previous formulas, Table 8 shows the results of
the maximum power dissipation at 3 and 5W with air-flow and no heat sink (refer to
Table 6 to calculate other power dissipation values).
Table 8. Thermal Parameters With Forced Air Flow and No Heat Sink
Thermal Mgmt.
Technique
Defined Parameters
Measured
Air-flow velocity
PD
100 LFM
3W
TJ
125°C
ΦJC
1°C/W
ΦJA
11.7°C/W
250 LFM
3W
125°C
1°C/W
10°C/W
500 LFM
3W
125°C
1°C/W
8.9°C/W
750 LFM
3W
125°C
1°C/W
8.5°C/W
1000 LFM
3W
125°C
1°C/W
8.3°C/W
100 LFM
5W
125°C
1°C/W
11.7°C/W
250 LFM
5W
125°C
1°C/W
10°C/W
500 LFM
5W
125°C
1°C/W
8.9°C/W
750 LFM
5W
125°C
1°C/W
8.5°C/W
1000 LFM
5W
125°C
1°C/W
8.3°C/W
ΦCA
10.7°C/W
9°C/W
7.9°C/W
7.5°C/W
7.3°C/W
10.7°C/W
9°C/W,
7.9°C/W
7.5°C/W
7.3°C/W
Calculated
TC
122°C
122°C
122°C
122°C
122°C
120°C
120°C
120°C
120°C
120°C
TA
89.9°C
95°C
98.3°C
99.5°C
100.1°C
66.5°C
75°C
80.5°C
82.5°C
83.5°C
13
2116A–HIREL–09/02
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Description
The TS68040 is Atmel’s third generation of 68000-compatible, high-performance, 32-bit microprocessors. The TS68040 is a virtual memory microprocessor employing multiple, concurrent execution units and a highly integrated architecture to provide very high performance in a monolithic HCMOS device.

Features
• 26-42 MIPS Integer Performance
• 3.5-5.6 MFLOPS Floating-Point-Performance
• IEEE 754-Compatible FPU
• Independent Instruction and Data MMUs
• 4K bytes Physical Instruction Cache and 4K bytes Physical Data Cache Accessed Simultaneously
• 32-bit, Nonmultiplexed External Address and Data Buses with Synchronous Interface
• User-Object-Code Compatibility with All Earlier TS68000 Microprocessors
• Multimaster/Multiprocessor Support via Bus Snooping
• Concurrent Integer Unit, FPU, MMU, Bus Controller, and Bus Snooper Maximize Throughput
• 4G bytes Direct Addressing Range
• Software Support Including Optimizing C Compiler and UNIX® System V Port
• IEEE P 1149-1 Test Mode (JTAG)
• f = 25 MHz, 33 MHz; VCC = 5V ± 5%; PD = 7W
• The Use of the TS88915T Clock Driver is Suggested

 

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