|TS68020MR1B/C16||HCMOS 32-bit Virtual Memory Microprocessor|
|TS68020MR1B/C16 Datasheet PDF : 45 Pages |
The total thermal resistance of a package (θJA) can be separated into two components,
θJC and θCA, representing the barrier to heat flow from the semiconductor junction to the
package (case), surface (θJC) and from the case to the outside ambient (θCA). These
terms are related by the equation:
θJA = θJC = θCA
θJC is device related and cannot be influenced by the user. However, θCA is user depen-
dent and can be minimized by such thermal management techniques as heat sinks,
ambient air cooling and thermal convection. Thus, good thermal management on the
part of the user can significantly reduce θCA so that θJA approximately equals θJC. Substi-
tution of θJC for θJA in equation (1) will result in a lower semiconductor junction
The microcircuits shall meet all mechanical environmental requirements of MIL-STD-
883 for class B devices.
The document where are defined the marking are identified in the related reference doc-
uments. Each microcircuit are legible and permanently marked with the following
information as minimum:
• ATMEL Logo
• Manufacturer’s Part Number
• Class B Identification
• Date-code of Inspection Lot
• ESD Identifier if Available
• Country of Manufacturing
Is in accordance with MIL-M-38510 and method 5005 of MIL-STD-883. Group A and B
inspections are performed on each production lot. Group C and D inspections are per-
formed on a periodical basis.
All static and dynamic electrical characteristics specified and the relevant measurement
conditions are given below.
(last issue on request to our marketing services).
Table 5: Static electrical characteristics for all electrical variants.
Table 6: Dynamic electrical characteristics for 68020-16 (16.67 MHz), 68020-20 (20
MHz) and 68020-25 (25 MHz).
For static characteristics, test methods refer to “Test Conditions Specific to the Device”
on page 14 hereafter of this specification (Table 7).
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