SLVSB30B – SEPTEMBER 2011 – REVISED AUGUST 2013
The device incorporates an overvoltage transient protection circuit to minimize voltage overshoot. The OVP
feature minimizes the output overshoot by implementing a circuit to compare the FB pin voltage to OVP threshold
which is 109% of the internal voltage reference. If the FB pin voltage is greater than the OVTP threshold, the
high side MOSFET is disabled preventing current from flowing to the output and minimizing output overshoot.
When the FB voltage drops lower than the OVP lower threshold which is 107%, the high side MOSFET is
allowed to turn on the next clock cycle.
TPS652510 features a supervisor circuit which monitors each buck’s output and the PGOOD pin is asserted
once sequencing is done. The PGOOD pin is an open drain output. The PGOOD pin is pulled low when any
buck converter is pulled below 85% of the nominal output voltage. The PGOOD is pulled up when all converter
outputs are more than 90% of its nominal output voltage. The default reset time is 100 ms. The polarity of the
PGOOD is active high.
The device implements an internal thermal shutdown to protect itself if the junction temperature exceeds 160°C.
The thermal shutdown forces the device to stop operating when the junction temperature exceeds thermal trip
threshold. Once the die temperature decreases below 140°C, the device reinitiates the power up sequence. The
thermal shutdown hysteresis is 20°C.
-40°C to 125°C
40-Pin (QFN) - RHA
Reel of 2500
(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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