CXL5005M View Datasheet(PDF) - Sony Semiconductor
Part Name
Description
View to exact match
CXL5005M Datasheet PDF : 8 Pages
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Package Outline
Unit: mm
CXL5005M
14PIN SOP (PLASTIC)
+ 0.4
9.9 – 0.1
14
8
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
7
1.27
+ 0.1
0.2 – 0.05
CXL5005M/P
0.24 M
CXL5005P
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-14P-L01
SOP014-P-0300
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
0.2g
+ 0.4
19.2 – 0.1
14PIN DIP (PLASTIC)
14
8
1
7
2.54
0° to 15°
0.5 ± 0.1
1.2 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-14P-01
DIP014-P-0300
Similar to MO-001-AH
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
0.9g
–8–
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