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TMP103BYFFT View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
TMP103BYFFT Low-Power, Digital Temperature Sensor With Two-Wire Interface in WCSP TI
Texas Instruments TI
TMP103BYFFT Datasheet PDF : 30 Pages
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TMP103
SBOS545B – FEBRUARY 2011 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configurations and Functions ....................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 3
6.3 Recommended Operating Conditions....................... 3
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Timing Requirements ................................................ 5
6.7 Typical Characteristics .............................................. 9
7 Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 11
7.5 Programming........................................................... 11
7.6 Register Maps ......................................................... 16
8 Application and Implementation ........................ 19
8.1 Application Information............................................ 19
8.2 Typical Application ................................................. 19
9 Power Supply Recommendations...................... 21
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 21
11 Device and Documentation Support ................. 22
11.1 Community Resources.......................................... 22
11.2 Trademarks ........................................................... 22
11.3 Electrostatic Discharge Caution ............................ 22
11.4 Glossary ................................................................ 22
12 Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (March 2011) to Revision B
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
• Added SSDs, Servers, Telecom, Set Top Boxes, Low Power Environmental, and Sensors to Applications section............ 1
Changes from Original (February 2011) to Revision A
Page
• Changed Package-Lead from WCSP-4 to DSBGA-4 in Device Information table ................................................................ 1
2
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