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TMP12FS View Datasheet(PDF) - Analog Devices

Part Name
Description
View to exact match
TMP12FS
ADI
Analog Devices ADI
TMP12FS Datasheet PDF : 0 Pages
TMP12
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . ؊0.3 V to ؉15 V
Heater Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ؉6 V
Setpoint Input Voltage . . . . . . . . . . . ؊0.3 V to [(V؉) ؉0.3 V]
Reference Output Current . . . . . . . . . . . . . . . . . . . . . . . . 2 mA
Open-Collector Output Current . . . . . . . . . . . . . . . . . . 50 mA
Open-Collector Output Voltage . . . . . . . . . . . . . . . . . . . ؉15 V
Operating Temperature Range . . . . . . . . . . ؊55°C to ؉150°C
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . ؉175°C
Storage Temperature Range . . . . . . . . . . . . ؊65°C to ؉160°C
Lead Temperature(Soldering, 60 sec) . . . . . . . . . . . . . ؉300°C
Package Type
8-Pin Plastic DIP (P)
8-Lead SOIC (S)
ΘJA
ΘJC
1031 43
1582 43
Units
°C/W
°C/W
NOTES
1ΘJA is specified for device in socket (worst case conditions).
2ΘJA is specified for device mounted on PCB.
CAUTION
1. Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this
specification is not implied. Exposure to the above maximum
rating conditions for extended periods may affect device reli-
ability.
2. Digital inputs and outputs are protected, however, permanent
damage may occur on unprotected units from high-energy
electrostatic fields. Keep units in conductive foam or packaging
at all times until ready to use. Use proper antistatic handling
procedures.
3. Remove power before inserting or removing units from their
sockets.
ORDERING GUIDE
FUNCTIONAL DESCRIPTION
The TMP12 incorporates a heating element, temperature sen-
sor, and two user-selectable setpoint comparators on a single
substrate. By generating a known amount of heat, and using the
setpoint comparators to monitor the resulting temperature rise,
the TMP12 can indirectly monitor the performance of a
system’s cooling fan.
The TMP12 temperature sensor section consists of a bandgap
voltage reference which provides both a constant 2.5 V output
and a voltage which is proportional to absolute temperature
(VPTAT). The VPTAT has a precise temperature coefficient of
5 mV/K and is 1.49 V (nominal) at ؉25°C. The comparators
compare VPTAT with the externally set temperature trip points
and generate an open-collector output signal when one of their
respective thresholds has been exceeded.
The heat source for the TMP12 is an on-chip 100 low
tempco thin-film resistor. When connected to a 5 V source, this
resistor dissipates:
PD =
V2
R
52 V
=
= 0.25 W ,
100
which generates a temperature rise of about 32°C in still air for
the SO packaged device. With an airflow of 450 feet per minute
(FPM), the temperature rise is about 22°C. By selecting a temp-
erature setpoint between these two values, the TMP12 can provide
a logic-level indication of problems in the cooling system.
A proprietary, low tempco thin-film resistor process, in conjunc-
tion with production laser trimming, enables the TMP12 to
provide a temperature accuracy of ؎3°C (typ) over the rated
temperature range. The open-collector outputs are capable of
sinking 20 mA, allowing the TMP12 to drive small control re-
lays directly. Operating from a single ؉5 V supply, the quiescent
current is only 600 µA (max), without the heater resistor current.
Temperature
Model/Grade Range1
TMP12FP
TMP12FS
TMP12GBC
XIND
XIND
؉25°C
NOTE
1XIND = ؊40°C to ؉125°C
Package
Package
Description Option
Plastic DIP
SOIC
Die
N-8
SO-8
–4–
REV. 0
 

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