TLP200D View Datasheet(PDF) - Toshiba
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TLP200D Datasheet PDF : 6 Pages
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Absolute Maximum Ratings (Ta = 25°C)
TLP200D
Characteristics
Symbol
Rating
Unit
Forward current
Forward current derating
(Ta ≥ 25°C)
Pulse forward current
(100 μs pulse, 100 pps)
LED
Reverse voltage
Diode power dissipation
Diode power dissipation derating
(Ta ≥ 25°C)
Junction temperature
Off-state output terminal voltage
On-state current
Detector
On-state RMS current derating
(Ta ≥ 25°C)
Output power dissipation
Output power dissipation derating
(Ta ≥ 25°C)
Junction temperature
Storage temperature range
Operating temperature range
Lead soldering temperature (10 s)
Isolation voltage (AC, 60 s, R.H. ≤ 60 %)
(Note 1)
IF
∆IF/°C
IFP
VR
PD
ΔPD /°C
Tj
VOFF
ION
∆ION/°C
PO
ΔPO / °C
Tj
Tstg
Topr
Tsol
BVS
50
mA
-0.5
mA/°C
1
A
5
V
50
mW
-0.5
mW/°C
125
200
200
-2.0
180
-1.8
125
-55 to 125
-40 to 85
260
1500
°C
V
mA
mA/°C
mW
mW / °C
°C
°C
°C
°C
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two-terminal device: Pins 1, 2, 3 and 4 shorted together and pins 5, 6, 7 and 8 shorted
together.
Note 2: Two channels operating simultaneously.
Recommended Operating Conditions
Characteristics
Symbol
Min Typ. Max Unit
Supply voltage
Forward current
On-state current
Operating temperature
VDD
―
150 200
V
IF
5
7.5
25
mA
ION
―
―
130 mA
Topr
-20
―
65
°C
Note:
Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
© 2019
2
Toshiba Electronic Devices & Storage Corporation
2019-06-17
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