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TLP1004AF View Datasheet(PDF) - Toshiba

Part Name
Description
View to exact match
TLP1004AF
Toshiba
Toshiba Toshiba
TLP1004AF Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
TLP1004A(F),TLP1005A(F)
Precaution
Please be careful of the followings.
1. Soldering should be performed after lead forming.
2. If chemicals are used for cleaning, the soldered surface only shall be cleaned with chemicals avoiding the whole
cleaning of the package.
3. The container is made of polycarbonate. polycarbonate is usually stable with acid, alcohol, and aliphatic
hydrocarbons however, with petrochemicals (such as benzene, toluene, and acetone), alkali, aromatic
hydrocarbons, or chloric hydrocarbons, polycarbonate becomes cracked, swollen, or melted. Please take care
when choosing a packaging material by referencing the table below.
<Chemicals To Avoid With Polycarbonate>
Phenomenon
A
Little deterioration
but staining
B
Cracked, crazed, or
swollen
C
Melted
( ) : Used as solvent.
D Decomposed
Chemicals
Nitric acid (low concentration), hydrogen peroxide, chlorine
Acetic acid (70% or more)
Gasoline
Methyl ethyl ketone, ethyl acetate, butyl acetate
Ethyl methacrylate, ethyl ether, MEK
Acetone, mamino alcohol, carbon tetrachloride
Carbon disulfide, trichloroethylene, cresol
Thinners, oil of turpentine
Triethanolamine, TCP, TBP
Concentrated sulfuric acid
Benzene
Styrene, acrylonitrile, vinyl acetate
Ethylenediamine, diethylenediamine
(Chloroform, methyl chloride, tetrachloromethane, dioxane,
1, 2dichloroethane)
Ammonia water
Other alkali
4. During 100µs after turning on VCC, output voltage changes for stabilizing the inner circuit.
5. Supply the bypass condenser up to 0.01µF between VCC and GND near device to stabilize the power supply
line.
5
2004-02-13
 

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