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Número de piezacomponentes Descripciónfabricante
TLE2074MJ EXCALIBUR LOW-NOISE HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS TI
Texas Instruments TI
TLE2074MJ Datasheet PDF : 89 Pages
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TLE207x, TLE207xA
EXCALIBUR LOW-NOISE HIGH-SPEED
JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS181C − FEBRUARY 1997 − REVISED DECEMBER 2009
TLE2071 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE
CHIP CARRIER
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
(D)
2 mV
TLE2071ACD
0°C to 70°C
4 mV
TLE2071CD
TLE2071ACP
TLE2071CP
2 mV
TLE2071AID
−40°C to 85°C
4 mV
TLE2071ID
TLE2071AIP
TLE2071IP
−55°C to 125°C
2 mV
4 mV
TLE2071AMFK TLE2071AMJG
TLE2071MFK
TLE2071MJG
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2071ACDR).
CERAMIC
FLAT PACK
(U)
TLE2071AMU
TLE2071MU
TLE2072 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE
CHIP
CARRIER
CERAMIC
DIP
PLASTIC
DIP
(D)
(FK)
(JG)
(P)
3.5 mV TLE2072ACD
0°C to 70°C
6 mV TLE2072CD
TLE2072ACP
TLE2072CP
−40°C to 85°C
3.5 mV
6 mV
TLE2072AID
TLE2072ID
TLE2072AIP
TLE2072IP
−55°C to 125°C
3.5 mV
6 mV
TLE2072AMFK
TLE2072MFK
TLE2072AMJG
TLE2072MJG
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2072ACDR).
CERAMIC
FLAT PACK
(U)
TLE2072AMU
TLE2072MU
TLE2074 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE
CHIP
CARRIER
CERAMIC
DIP
PLASTIC
DIP
(DW)
(FK)
(J)
(N)
3 mV TLE2074ACDW
0°C to 70°C
5 mV TLE2074CDW
TLE2074ACN
TLE2074CN
3 mV TLE2074AIDW
−40°C to 85°C
5 mV TLE2074IDW
TLE2074AIN
TLE2074IN
−55°C to 125°C
3 mV
5 mV
TLE2074AMFK
TLE2074MFK
TLE2074AMJ
TLE2074MJ
The DW packages are available taped and reeled. Add R suffix to device type (e.g., TLE2074ACDWR).
CERAMIC
FLAT PACK
(W)
TLE2074AMW
TLE2074MW
symbol
IN +
+
IN −
OUT
2
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