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Y3574 View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
Y3574 5-V ANALOG, 3-/5-V DIGITAL, 14-/12-BIT, 200-KSPS, 4-/8-CHANNEL SERIAL ANALOG-TO-DIGITAL CONVERTERS WIRH ±10-V INPUTS TI
Texas Instruments TI
Y3574 Datasheet PDF : 51 Pages
First Prev 31 32 33 34 35 36 37 38 39 40 Next Last
PACKAGE OPTION ADDENDUM
www.ti.com
8-Nov-2014
Orderable Device
TLC3578IDWG4
TLC3578IDWR
TLC3578IPW
TLC3578IPWG4
TLC3578IPWR
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE
SOIC
DW 24
25 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
DW 24 2000 Green (RoHS
& no Sb/Br)
ACTIVE TSSOP
PW
24
60 Green (RoHS
& no Sb/Br)
ACTIVE TSSOP
PW
24
60 Green (RoHS
& no Sb/Br)
ACTIVE TSSOP
PW 24 2000 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp Op Temp (°C)
(3)
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-2-260C-1 YEAR -40 to 85
Level-2-260C-1 YEAR -40 to 85
Level-2-260C-1 YEAR -40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
TLC3578I
TLC3578I
Y3578
Y3578
Y3578
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Samples
Addendum-Page 2
Direct download click here
 

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