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TISP7125F3D View Datasheet(PDF) - Power Innovations Ltd

Part Name
Description
View to exact match
TISP7125F3D Datasheet PDF : 25 Pages
First Prev 21 22 23 24 25
TISP7125F3, TISP7150F3, TISP7180F3, TISP7240F3, TISP7260F3,
TISP7290F3, TISP7320F3, TISP7350F3, TISP7380F3
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1994 - REVISED MARCH 2000
MECHANICAL DATA
P008
plastic dual-in-line package
This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions The package is intended for
insertion in mounting-hole rows on 7,62 (0.300) centres. Once the leads are compressed and inserted,
sufficient tension is provided to secure the package in the board during soldering. Leads require no additional
cleaning or processing when used in soldered assembly.
P008
9,75 (0.384)
9,25 (0.364)
8
7
6
5
Index
Notch
6,60 (0.260)
6,10 (0.240)
1
2
3
4
1,78 (0.070) MAX
4 Places
8,23 (0.324)
7,62 (0.300)
5,08 (0.200)
MAX
0,51 (0.020)
MIN
3,17 (0.125)
MIN
Seating
Plane
0,36 (0.014)
0,20 (0.008)
0,53 (0.021)
0,38 (0.015)
8 Places
2,54 (0.100) Typical
(see Note A)
6 Places
9,40 (0.370)
8,38 (0.330)
ALL LINEAR DIMENSIONS IN MILLIMETERS AND PARANTHETICALLY IN INCHES
MDXXCF
NOTES: A. Each pin centreline is located within 0,25 (0.010) of its true longitudinal position.
B. Dimensions fall within JEDEC MS001 - R-PDIP-T, 0.300" Dual-In-Line Plastic Family.
C. Details of the previous dot index P008 package style, drawing reference MDXXABA, are given in the earlier publications.
PRODUCT INFORMATION
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