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TISP7125F3 View Datasheet(PDF) - Power Innovations Ltd

Part Name
Description
View to exact match
TISP7125F3 Datasheet PDF : 25 Pages
First Prev 21 22 23 24 25
TISP7125F3, TISP7150F3, TISP7180F3, TISP7240F3, TISP7260F3,
TISP7290F3, TISP7320F3, TISP7350F3, TISP7380F3
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1994 - REVISED MARCH 2000
MECHANICAL DATA
D008
plastic small-outline package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
D008
5,00 (0.197)
4,80 (0.189)
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
8
7
6
5
6,20 (0.244)
5,80 (0.228)
INDEX
4,00 (0.157)
3,81 (0.150)
1,75 (0.069)
1,35 (0.053)
1
2
3
4
7° NOM
3 Places
0,50 (0.020)
0,25 (0.010)
x 45°NOM
5,21 (0.205)
4,60 (0.181)
0,203 (0.008)
0,102 (0.004)
0,79 (0.031)
0,28 (0.011)
0,51 (0.020)
0,36 (0.014)
8 Places
Pin Spacing
1,27 (0.050)
(see Note A)
6 Places
0,229 (0.0090)
0,190 (0.0075)
7° NOM
4 Places
1,12 (0.044)
0,51 (0.020)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0,15 (0.006).
D. Lead tips to be planar within ±0,051 (0.002).
PRODUCT INFORMATION
4° ± 4°
MDXXAAC
21
 

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