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E-TEA3718SP View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
E-TEA3718SP
ST-Microelectronics
STMicroelectronics ST-Microelectronics
E-TEA3718SP Datasheet PDF : 26 Pages
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Electrical specifications
3.3
Thermal data
Table 6. Thermal data
Symbol
Parameters
Rth(j-c) Maximum junction-case thermal resistance
Rth(j-a) Maximum junction-ambient thermal resistance
1. Soldered on a 35 µm thick 4 cm2 PC board copper area
SO20
16
60(1)
Figure 5. Maximum power dissipation
Power DIP
11
45(1)
Multiwatt 15 Unit
3
oC/W
40
oC/W
Figure 6. Typical external component configuration
RS = 1 ohm inductance free
RC = 470 ohms
CC = 820 pF ceramic
Rt = 56 kohms
Ct = 820 pF ceramic
P = 500 ohms
R2 = 1 kohm
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