Philips Semiconductors
Low voltage versatile telephone
transmission circuits with dialler interface
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil)
Product speciļ¬cation
TEA1112; TEA1112A
SOT38-4
D
L
Z
e
b
16
pin 1 index
A2 A
A1
wM
b1
b2
9
ME
c
(e 1)
MH
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73 0.53
1.30 0.38
1.25 0.36 19.50 6.48
0.85 0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches 0.17
0.020
0.13
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.030
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT38-4
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
1997 Mar 26
16