Philips Semiconductors
Voice switched speakerphone IC
PACKAGE OUTLINES
DIP24: plastic dual in-line package; 24 leads (600 mil)
Product speciļ¬cation
TEA1095
SOT101-1
D
L
Z
e
24
pin 1 index
A2 A
A1
wM
b1
b
13
ME
c
(e 1)
MH
E
1
12
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
5.1 0.51 4.0
1.7
1.3
0.53 0.32
0.38 0.23
32.0
31.4
14.1
13.7
2.54 15.24
3.9
3.4
15.80 17.15
15.24 15.90
0.25
2.2
inches
0.20
0.020
0.16
0.066 0.021 0.013
0.051 0.015 0.009
1.26
1.24
0.56
0.54
0.10
0.60
0.15
0.13
0.62
0.60
0.68
0.63
0.01 0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT101-1
IEC
051G02
REFERENCES
JEDEC
EIAJ
MO-015AD
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-23
1997 Nov 25
20