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TDA1308TT View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
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TDA1308TT
NXP
NXP Semiconductors. NXP
TDA1308TT Datasheet PDF : 19 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
13. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
TDA1308; TDA1308A
Class-AB stereo headphone driver
SOT97-1
D
L
Z
e
b
8
A2 A
A1
wM
b1
b2
5
pin 1 index
E
ME
c
(e 1)
MH
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
min. max.
b
b1
b2
c
D (1)
E (1)
mm
4.2
0.51
3.2
1.73 0.53 1.07 0.36
1.14 0.38 0.89 0.23
9.8
9.2
6.48
6.20
inches 0.17
0.02
0.13
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
e
2.54
0.1
e1
7.62
0.3
L
3.60
3.05
0.14
0.12
ME
8.25
7.80
0.32
0.31
MH
10.0
8.3
0.39
0.33
w
Z (1)
max.
0.254 1.15
0.01 0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT97-1
IEC
050G01
REFERENCES
JEDEC
JEITA
MO-001
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 12. Package outline SOT97-1 (DIP8)
TDA1308_A_4
Product data sheet
Rev. 04 — 25 January 2007
© NXP B.V. 2007. All rights reserved.
10 of 19
 

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