T0905-TSPH View Datasheet(PDF) - Atmel Corporation
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T0905-TSPH Datasheet PDF : 9 Pages
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T0905 [Preliminary]
Figure 4. Recommended Package Footprint Extract from the PCB Showing a Part of
the Core Application (Without Components)
• Only ground signal traces are recommended directly under the package.
• Maximum density of ground vias guarantees an optimum connection of the ground
layers and the best diversion of the heat.
• Heat slug must be soldered to GND.
• Plugging of the ground vias under the heat slug is recommended to avoid soldering
problems.
7
4751D–SIGE–05/04
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