SY-1.5-K View Datasheet(PDF) - Fujitsu

Part Name

Description

View to exact match

SY-1.5-K

MINIATURE RELAY 1 POLE - 1 to 2A (For Signal Switching)

Fujitsu 

GENERAL INFORMATION

SY Series

1. ROHS Compliance

• All relays produced by Fujitsu Components are compliant with RoHS directive 2011/65/EU including amend-

ments.

• Use of Cadmium in electrical contacts is exempted as per Annex III of the RoHS directive 2001/65/EU.

Please consider expiry date of exemption. Relays with Cadmium containing contacts are not to be used for

new designs.

• All relays are lead-free. Please refer to Lead-Free Status Info for older date codes at:

http://www.fujitsu.com/downloads/MICRO/fcai/relays/lead-free-letter.pdf

• Characteristic data is not guaranteed values, but measured values of samples from production line.

2. Recommended lead free solder condition

• Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified. This material has

been verified to be compatible with PbSn assembly process.

• Recommended solder for assembly: Sn-3.0Ag-0.5Cu.

Flow Solder Condition:

Pre-Heating: maximum 120˚C

within 90 sec.

Soldering:

dip within 5 sec. at

255˚C ± 5˚C solder bath

Relay must be cooled by air immediately

after soldering

Solder by Soldering Iron:

Soldering Iron: 30-60W

Temperature: maximum 340-360˚C

Duration:

maximum 3 sec.

We highly recommend that you confirm your actual solder conditions

3. Moisture Sensitivity

• Moisture Sensitivity Level is not applicable to electromechanical relays, unless otherwise indicated.

4. Tin Whiskers

• Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable

length whisker was found by our in house test.

7

Share Link: