ST1353 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
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ST1353 Datasheet PDF : 3 Pages
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ST1331, ST1333, ST1353
card is unexpectedly extracted, while an operation
is underway, in an open reader.
EXTERNAL COMMANDS
The device uses six contacts: VCC, GND, I/O,
CLK, RST, B. Four commands distinct can be
composed using these external pins:
– RESET: to reset the internal address register to
000d
– READ: to increment the internal address
register and read the data bit at the new address
– COMPARE: to allow comparison of the
presented code against the internal transport
code
– PROGRAM: to program the bit at the current
address
CONFIGURATIONS
The device works in two distinct configurations:
– Issuer Configuration: for the card manufacturer.
Customized data can be written to the chip, to
initialize it before release to the end user.
– User Configuration: for use by the end user of
the card, but with restricted access.
OPTIONS
Three options can be chosen on ordering the
device:
– The anti-tearing mechanism can be
disconnected. In this case, the anti-tearing flag
area from bit 288d to bit 319d is unused (Figure
2).
– The user area, from bit 320d to bit 375d, can be
defined as “not erasable” in the User
Configuration.
– The reload mechanism can be activated. In this
case, erasing a bit in the reload counter
refreshes the certificate (CER). At this time, the
certificate can be programmed with a new
value.
ORDERING INFORMATION
The notation used for the device number is as
shown in Table 2. For a list of available options
(speed, package, etc.) or for further information on
any aspect of this device, please contact your
nearest ST Sales Office.
Table 2. Ordering Information Scheme
Example:
ST1333 – C W4 /
XX YY
Product
31 Issuer Area
33 Active Authentication Function
53 Cipher Block Chaining
Authentication Function
Transport Code
Given by ST
Customer Code
Given by the Issuer
Fuse Blow Voltage
B
6 V1
C
5 V1
Note: 1. Please contact your nearest ST Sales Office to check on availability
Delivery Form
D10 Micromodule on reel
W4 Wafer (180 µm thickness)
W2 Wafer (280 µm thickness)
3/3
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