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ST-32 View Datasheet(PDF) - Vishay Semiconductors

Part NameDescriptionManufacturer
ST-32 Surface Mount Cermet Trimmers (single turn) Vishay
Vishay Semiconductors Vishay
ST-32 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Surface Mount Cermet Trimmers (single turn)
ST-32
Vishay
MECHANICAL SPECIFICATIONS
Mechanical turn
Operating torque
Stop Strength
250 ° (1 turn)
5 mN m {51 gf cm} maximum
20 mN m {204 gf cm} minimum
Rotational life
Thrust to rotor
Solderability
100 cycles
[ΔR/R ± (2 Ω + 3 %)]
5 N {0.51 kgf} minimum
Sn-Pb: 235 °C, 2 s
Sn-Cu (Lead (Pb)-free): 245 ± 3 °C, 2 3 s
Shear (Adhesion) 5 N {0.51 kgf} 10 s
Substrate bending Width 90 mm, bend 3 mm, 5 s, 1 time
Pull-off strength 5 N {0.51 kgf} 10 s
ELECTRICAL CHARACTERISTICS
Nominal resistance
range
Resistance tolerance
Power ratings
10 Ω ∼ 2 MΩ
± 20 %
0.125 W (70 °C) 0 W (125 °C)
Resistance law
Linear law (B)
Maximum input
voltage
DC200 V or power rating, whichever is
smaller
Maximum wiper
current
100 mA or power rating, whichever is
smaller
Effective electrical
angle
210 ° (1 turn)
End resistance
1 % or 2 Ω, whichever is greater
C.R.V.
1 % or 3 Ω, whichever is greater
Operating temp. range
- 55 125 °C
Temp. coefficient
10 Ω ∼ 50 Ω: ± 250 10-6 /°C maximum
100 Ω ∼ 2 MΩ: ± 100 10-6 /°C maximum
Insulation resistance
1000 MΩ minimum (DC500 V)
Dielectric strength
AC500 V, 60 s
Net weight
Approx. 0.05 g (ST-32A, B, EA, EB)
Approx. 0.11 g (ST-32G, H, EG, EH)
Reflow profile for soldering heat evaluation
(°C)
250
200
180 °C
150 150°C
100
50
Peak
:
250
+5
0
°C
Over 230 °C
Pre Heating Zone
90 ± 30 s
30 ± 10 s
Heating time Soldering Zone
Reflow : two times maximum
ENVIRONMENTAL SPECIFICATIONS
Test item
Thermal shock
Humidity
Shock
Vibration
Load Life
Low
temperature
operation
Test conditions
- 65 125 °C (0.5 h),
5 cycles
- 10 65 °C (Relative
humidity 80 98 %),
10 cycles, 240 h
981 m/s2, 6 ms
6 directions for 3 times
each
Amplitude 1.52 mm or
Acceleration 196 m/s2,
10 2000 Hz,
3 directions, 12 times
each
70 °C, 0.125 W, 1000 h
- 55 °C, 2 h
Specifications
[ΔR/R 2 %]
[S.S. 1 %]
[ΔR/R 2 %]
[ΔR/R 1 %]
[S.S. 1 %]
[ΔR/R 3 %]
[S.S. 1 %]
[ΔR/R 2 %]
[S.S. 2 %]
High
temperature
exposure
125 °C, 250 h
[ΔR/R 3 %]
[S.S. 2 %]
Immersion seal
85 °C, 60 s
No leaks (No
continuous bubbles)
Soldering heat
Sn-Pb
260 °C, 10 s or 215 °C,
35 s
S-Cu
Flow: 260 °C ± 3 °C as
the temperature in a pot
of molten solder,
immersion from head of
terminal to backside of
board, 5 6 s, two times
maximum
Reflow: Peak
temperature 255 °C
(Please refer to the
profile below.)
Manual soldering:
350 ± 10 °C, 3 4 s
[ΔR/R 1 %]
Document Number: 58009
Revision: 06-Mar-06
For technical questions contact: copalsupport@vishay.com
www.vishay.com
4
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