MC14513BCP View Datasheet(PDF) - Motorola => Freescale
Part Name
Description
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MC14513BCP Datasheet PDF : 9 Pages
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18
1
–T–
SEATING
PLANE F
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 726–04
ISSUE G
–A–
10
–B–
9
OPTIONAL LEAD
CONFIGURATION (1, 9, 10, 18)
C
N
K
G
D 18 PL
0.25 (0.010) M T A S
L
M
J 18 PL
0.25 (0.010) M T B S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F FOR FULL LEADS. HALF
LEADS OPTIONAL AT LEAD POSITIONS 1, 9,
10, AND 18.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.880 0.910 22.35 23.11
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.021 0.38 0.53
F 0.055 0.070 1.40 1.78
G 0.100 BSC
2.54 BSC
J 0.008 0.012 0.20 0.30
K 0.125 0.170 3.18 4.32
L 0.300 BSC
7.62 BSC
M
0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.02
18
1
A
F
D
H
G
10
B
9
P SUFFIX
PLASTIC DIP PACKAGE
CASE 707–02
ISSUE C
C
NK
SEATING
PLANE
L
M
J
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 22.22 23.24 0.875 0.915
B 6.10 6.60 0.240 0.260
C 3.56 4.57 0.140 0.180
D 0.36 0.56 0.014 0.022
F 1.27 1.78 0.050 0.070
G
2.54 BSC
0.100 BSC
H 1.02 1.52 0.040 0.060
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L
7.62 BSC
0.300 BSC
M 0_ 15_ 0 _ 15_
N 0.51 1.02 0.020 0.040
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51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MC14513B
◊
384
*MC14513B/D* MOTOROLA CMOS LMOCG14I5C13DBA/DTA
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