MSOP8-EP
X
C
G
Y2
X1
Y
Dimensions
Value
(in mm)
C
0.650
G
0.450
X
0.450
Y1
X1
2.000
Y
1.350
Y1
1.700
Y2
5.300
X
C2
Y
MSOP-10
Dimensions
Value
(in mm)
C1
X
0.30
Y
1.4
C1
4.4
C2
0.50
POWERDI®5
X
POWERDI®123 / POWERDI®323
Y
X1
G
X2
X1
(2x)
G
Y1
(2x)
C
Dimensions
C
G
X
X1
Y
Y1
Value (in mm)
1.840
0.852
3.360
1.390
4.860
1.400
Y2
Y1
Dimensions POWERDI®123 POWERDI®323
G
1.0
0.5
X1
2.2
2.0
X2
0.9
0.8
Y1
1.4
0.8
Y2
1.4
1.1
POWERDI®123 Type B
X
Y
G
X1
Dimensions
G
X
X1
Y
Value
(in mm)
2.000
1.050
4.100
1.500
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
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Suggested Pad Layout
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